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Optimizing Chips and Antennas?

Patent

US8640962

Owner

Philippe Charrin

Filing Date

November 06, 2007

Priority Date

November 06, 2006

Portfolio

RFID - Charrin

Intro

Read about this way of optimizing antennas and electronics, basically all RFID, by making it thinner but having the same power and ability as usual RFID products. Is this revolutionary? Give your opinion! 

Claims

1. A radio-frequency identification device comprising, embedded in an envelope: a substrate on one face of which an antenna is produced and a chip con...
  1. A radio-frequency identification device comprising, embedded in an envelope: a substrate on one face of which an antenna is produced and a chip connected to the antenna is positioned, a potting locally covering said substrate face level with the chip, wherein the radio-frequency identification device furthermore comprises, embedded in the envelope, an intermediate layer made of a magnetic superconductor material placed against the substrate on the antenna side, said intermediate layer having dimensions greater than dimensions of the antenna so as to cover the antenna and having a cavity arranged so that the potting and the chip is substantially completely housed therein. 
  2. Device according to claim 1, wherein the intermediate layer is made of a radio-frequency superconductor material containing ferrite. 
  3. Device according to claim 1, wherein the intermediate layer has a thickness of between 200 and 600 □m. 
  4. Device according to claim 1, wherein the cavity formed in the intermediate layer is a through orifice with a diameter of between 4 and 8 mm. 
  5. Device according to claim 1, wherein the antenna forms a ring and the intermediate layer comprises a through hole positioned facing a through hole formed in the central area formed by the antenna. 
  6. Device according to claim 1, wherein the envelope is made of a material comprising one or more of silicones, polyurethanes, polyethylenes, polyamides, and epoxy resins. 
  7. Device according to claim 1, wherein the substrate is made of a material comprising at least one of PET (polyethylene terephthalate), PVC (polyvinyl chloride), and a glass fibre/epoxy resin composite. 
  8. Device according to claim 1, further comprising an adhesive layer joined to one face of the envelope. 
  9. Method for producing a radio-frequency identification device in which a substrate is provided, on one face of which an antenna is produced and a chip connected to the antenna is positioned, a potting locally covering said substrate face level with the chip, the method comprising: providing an intermediate layer made of a magnetic superconductor material having dimensions greater than dimensions of the antenna and having a cavity arranged so that the potting is substantially completely housed therein; placing the intermediate layer against the substrate on the antenna side so that the antenna is covered by the intermediate layer and the potting is located in the cavity; producing an envelope around the assembly formed by the substrate, the antenna, the potting and the intermediate layer. 
  10. Method according to claim 9, wherein the envelope comprises a first layer placed on a side of the face of the intermediate layer opposite the substrate, and a second layer on a side of the face of the substrate opposite the antenna, the radio-frequency identification device being produced by laminating various constitutive layers. 
  11. Method according to claim 9, wherein the envelope is produced by moulding. 
  12. Method according to claim 9, wherein the layer and the envelope are held together by bonding. 
  13. Method according to claim 9, wherein the layer and the envelope are held together by lamination. 
  14. Object, configured to receive radio-frequency identification device comprising, embedded in an envelope, a substrate on one face of which an antenna is produced and a chip connected to the antenna is positioned, a potting locally covering said substrate face level with the chip, wherein the radio-frequency identification device furthermore comprises, embedded in the envelope, an intermediate layer made of a magnetic superconductor material placed against the substrate on the antenna side, said intermediate layer having dimensions greater than dimensions of the antenna so as to cover the antenna and having a cavity arranged so that the potting and the chip is substantially completely housed therein. 
  15. Object according to claim 14, wherein the envelope covers at least part of an outer surface of the object. 
  16. Object according to claim 14, wherein the envelope covers an entire outer surface of the object. 
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Abstract

The radio-frequency identification device includes embedded in an envelope a substrate on one face of which an antenna is produced and a chip connecte...
The radio-frequency identification device includes embedded in an envelope a substrate on one face of which an antenna is produced and a chip connected to the antenna is positioned, a potting locally covering the substrate face level with the chip, an intermediate layer made of a magnetic superconductor material placed against the substrate on the antenna side, the intermediate layer having dimensions greater than those of the antenna so as to be able to cover the antenna and having a cavity arranged so that the potting and the chip can be approximately completely housed therein.
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